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Micromachined Millimetre-Wave Passive Components at 38 and 77 GHz

Wang, Yi and Ke, M. and Lancaster, M.J. and Huang, F. and Lewis, R. (2009) Micromachined Millimetre-Wave Passive Components at 38 and 77 GHz. In: Joint 5th ESA Workshop on Millimetre Wave Technology and Applications and 31st ESA Antenna Workshop, 18-20 May 2009, ESTEC, Noordwijk, The Netherlands.

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A precision micro-fabrication technique has been developed for millimetre-wave components of air-filled three-dimensional structures, such as rectangular coaxial lines or waveguides. The devices are formed by bonding several layers of micromachining defined slices with a thickness of a few hundred micrometres. The slices are thickphotoresist SU8 defined by photolithography, or silicon with a pattern defined by deep reactive ion etching; both are coated with gold by evaporation. The process is simple, and low-cost, as compared with conventional precision metal machining, but yields mm-wave components with good performance. The components are light weight and truly airfilled with no dielectric support. This paper reviews several of these micromachined mm-wave components at 38 and 77 GHz for communications and radar applications.

Type of Work:Conference or Workshop Item
Date:18 May 2009 (Publication)
School/Faculty:Colleges (2008 onwards) > College of Engineering & Physical Sciences
Department:School of Electronic, Electrical and Computer Engineering

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Keywords:Micromachining; Novel fabrication techniques; Millimetre wave; Passive components
Subjects:TK Electrical engineering. Electronics Nuclear engineering
Institution:University of Birmingham
Copyright Holders:Authors
ID Code:264
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